New Disruptive Microchip Technology and The Secret Plan of Intel

In this video by Anastasi In Tech, the host discusses the latest advancements in microchip technology, focusing on TSMC’s new 1.6nm technology and Intel’s ambitious plans to regain leadership in the semiconductor industry. The video is divided into several sections, each covering different aspects of the new technology and its implications.

1. **Introduction**: The video begins with an overview of TSMC’s announcement of the 1.6nm technology, highlighting its significance for the semiconductor industry and technological progress.

2. **New 1.6nm Technology Explained**: The host explains the new transistor architecture and the concept of backside power delivery. Traditional transistors have all components on the front side of the wafer, but the new technology moves power delivery to the backside, freeing up space for signal routing and reducing congestion.

3. **Backside Power Delivery Explained**: This section delves deeper into the benefits of backside power delivery, such as improved power efficiency and reduced complexity in wiring interconnects. The host explains how this innovation allows for denser transistor placement and more efficient chip design.

4. **Intel Plan and Risks**: The video discusses Intel’s strategy to introduce gate-all-around (GAA) transistors and backside power delivery with their 20A process node. Intel aims to be the first to bring this technology to production, but the host highlights the risks associated with introducing two major innovations simultaneously.

5. **Direct Self-Assembly**: The host explains Intel’s plan to use direct self-assembly to address the economic challenges of high numerical aperture extreme ultraviolet (EUV) lithography. This technique involves using a special polymer material that self-organizes into tiny lines, potentially reducing costs and improving efficiency.

6. **ASM’s Role in Advanced Transistor Technologies**: The video highlights the importance of ASM’s equipment and process technology, particularly Atomic Layer Deposition (ALD), in enabling advanced transistor architectures like finFET and GAA. ASM’s machines are crucial for precise deposition of materials at the atomic level.

7. **Future of Transistor Technology**: The host discusses the future of transistor technology, including the transition to complementary FET (CFET) architectures and the potential for hyper numerical aperture EUV machines. CFET involves stacking transistors vertically to further reduce footprint and improve performance.

8. **Conclusion**: The video concludes with a summary of the key points and a call to action for viewers to share the video and connect on LinkedIn for updates on the host’s career and future content.

Throughout the video, the host provides detailed explanations, industry insights, and visual aids to help viewers understand the complexities of the new microchip technologies and their potential impact on the semiconductor industry.